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i2a-tech.com

wafer ubm and bumping, bga, fpbga-lga, fcbga, wire bonding, wlcsp, flip chip, stacked die, qfn dfn, qfp package family, sip mcm, open cavity packages

I2a Technologies provides wafer packaging services. From dicing and wirebonding, to wafer level packaging ie, ubm, bumping flip chip, bga, etc.

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