IC Packaging solutions for shipping and handling microelectronic devices for the semiconductor device industry, including bare die trays, IC trays, JEDEC trays and matrix trays with horizontal and film frame shippers

IC Packaging solutions for shipping and handling microelectronic devices for the semiconductor device industry, including bare die trays, IC trays, JEDEC trays and matrix trays with horizontal and film frame shippers

IC Packaging solutions for shipping and handling microelectronic devices for the semiconductor device industry, including bare die trays, IC trays, JEDEC trays and matrix trays with horizontal and film frame shippers

IC Packaging solutions for shipping and handling microelectronic devices for the semiconductor device industry, including bare die trays, IC trays, JEDEC trays and matrix trays with horizontal and film frame shippers

we build what others cant, military, aerospace, chip and wire, wirebond, flip chip, all manner of microelectronics

IC Packaging solutions for shipping and handling microelectronic devices for the semiconductor device industry, including bare die trays, IC trays, JEDEC trays and matrix trays with horizontal and film frame shippers

IC Packaging solutions for shipping and handling microelectronic devices for the semiconductor device industry, including bare die trays, IC trays, JEDEC trays and matrix trays with horizontal and film frame shippers

IC Packaging solutions for shipping and handling microelectronic devices for the semiconductor device industry, including bare die trays, IC trays, JEDEC trays and matrix trays with horizontal and film frame shippers

IC Packaging solutions for shipping and handling microelectronic devices for the semiconductor device industry, including bare die trays, IC trays, JEDEC trays and matrix trays with horizontal and film frame shippers

Aeroflex Microelectronics Divisions offer components for a variety of applications such as HiRel, Avionics, RF and Microwave, Electronic Manufacturing Services.

Aeroflex Microelectronics Divisions offer components for a variety of applications such as HiRel, Avionics, RF and Microwave, Electronic Manufacturing Services.

BARAN Microelectronic is a hardware development and manufacturing company. Beyond our products we offer PCB design and layout, FPGA design, software development and low volume manufacturing services.

Aeroflex Microelectronics Divisions offer components for a variety of applications such as HiRel, Avionics, RF and Microwave, Electronic Manufacturing Services.

Aeroflex Microelectronics Divisions offer components for a variety of applications such as HiRel, Avionics, RF and Microwave, Electronic Manufacturing Services.

Teledyne Electronic Technologies - Lewisburg Facility is a major contract manufacturer of microelectronic devices for industry and the military

Teledyne Electronic Technologies - Lewisburg Facility is a major contract manufacturer of microelectronic devices for industry and the military

Aeroflex Microelectronics Divisions offer components for a variety of applications such as HiRel, Avionics, RF and Microwave, Electronic Manufacturing Services.

Aeroflex Microelectronics Divisions offer components for a variety of applications such as HiRel, Avionics, RF and Microwave, Electronic Manufacturing Services.