FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.
The Hesse (Mechatronics) GmbH, headquartered in Paderborn, Germany, develops and manufactures Thin (Fine) Wire Bonder, Heavy Wire Bonder, Flipchip Bonder and custom solutions for Automation
The Hesse (Mechatronics) GmbH, headquartered in Paderborn, Germany, develops and manufactures Thin (Fine) Wire Bonder, Heavy Wire Bonder, Flipchip Bonder and custom solutions for Automation
The Hesse (Mechatronics) GmbH, headquartered in Paderborn, Germany, develops and manufactures Thin (Fine) Wire Bonder, Heavy Wire Bonder, Flipchip Bonder and custom solutions for Automation
1Talon semiconductor has a robust DI process for real world analog bipolar design requirements Rad Hard. Combines with their unique patented packaging solutions. We can reverse engineer old di designs and create newer low cost solutions using our unique
DELO - leading by intelligent bonding technology. We support you in the product development process and supply you with high-performance adhesives and technology specifically adapted to your needs.
Distributor of machines, materials and consumables in the Nordic Microelectronic market. We are specialized in Wirebonding, Diebonding, Testing, Inspection, Wafer, Hybrid and Tools & Material.