Ceramic Substrates is widely used in the electronics industry thick-film circuit, large-scale integrated circuits, mixed IC, semiconductor packaging, chip
The leader in thin film heating technology, Thermo-Stone USA custom designs heating solutions by utilizing thin film technology bonded to a substrate such as ceramic or glass. Leading industry by providing innovative solutions to demanding heating applica
K Lab provides high quality, quick turn-around specialty optical coating services and thin film characterization. Our coating specialty covers discrete laser diodes and bars, fiber tips, and traditional optical coating on glass and semiconductor substrate
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
MMT manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
The leader in thin film heating technology, Thermo-Stone USA custom designs heating solutions by utilizing thin film technology bonded to a substrate such as ceramic or glass. Leading industry by providing innovative solutions to demanding heating applica
Viking Tech America Corporation is a well-experienced Passive components Manufacturer, offering Power Inductor, Thin Film Resistor, RF Inductor, Multilayer Capacitor, Ceramic Capacitor, LED Substrate, and Common Mode Choke with superior quality.
MMT manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
MMT manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
Capable of high volume thick film and etch substrate upto 14,000 hermetic vias, 1.3 mil line and space, 14in dia substrate, multilayer, double sided substrate for RF, Defense, Space, Semiconductor, MEMS & Bio-Tech Applications.