The patented, original ERSASCOPE BGA optical inspection system was designed for the non-destruction visual inspection of hidden solder joints as by BGA, Ball Grid Array, CSP, Chip Scale Package and Flip Chips.
The patented, original ERSASCOPE BGA optical inspection system was designed for the non-destruction visual inspection of hidden solder joints as by BGA, Ball Grid Array, CSP, Chip Scale Package and Flip Chips.
We are committed to providing the global semiconductor packaging manufacturers with innovative, high performance materials. Our products enable our valued customers to meet the evolving and demanding needs of the industry.
We are committed to providing the global semiconductor packaging manufacturers with innovative, high performance materials. Our products enable our valued customers to meet the evolving and demanding needs of the industry.
We distributes and supports semiconductor assembly capital equipments, scriber and breaker, die bonder, wire bonder, AOI system, laser resistor trimming, SMT equipment. We offer consulting service for the microelectronic industry in process development a
SphereTek offers Solder Spheres from 50 to 1250 Microns with Uniformity and Sphericity Down to ±2.5µ Tolerance. SphereTek offers standard sizes from 50µ to 1250µ diameters and can work with any metallurgy including traditional and RoHS compliant solder a
Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and innovation, Amkor has become a trusted partner for most of the world’s leading semiconductor
AMICRA Microtechnologies' high precision die bonder and flip chip bonders, wafer ink systems and dispense & test systems can optimize your bond process and reduce costs in back-end packaging. We offer products for the entire industry field of microele
A source for technical flip chip and micro packaging information. Tutorials, industry connections, research and flip chip technology videos and photos.
gold chip technology for known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components
3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces and provides a broad range of advanced packaging solutions from stacked chip solutions to wafer
Auto Moto Keys was founded in 2000 and has grown into the industry's most complete Supply Chain Services Provider in Middle East. We are Lebanon’s best independent Tool & Equipment Specialist and we credit that success to our 3 core values: Team Building,