Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and innovation, Amkor has become a trusted partner for most of the world’s leading semiconductor
AMICRA Microtechnologies' high precision die bonder and flip chip bonders, wafer ink systems and dispense & test systems can optimize your bond process and reduce costs in back-end packaging. We offer products for the entire industry field of microele
A source for technical flip chip and micro packaging information. Tutorials, industry connections, research and flip chip technology videos and photos.
gold chip technology for known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components
3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces and provides a broad range of advanced packaging solutions from stacked chip solutions to wafer
Auto Moto Keys was founded in 2000 and has grown into the industry's most complete Supply Chain Services Provider in Middle East. We are Lebanon’s best independent Tool & Equipment Specialist and we credit that success to our 3 core values: Team Building,
Waterfall Technologies provides SMT Training workshops, Public Programs,Inhouse SMT training Programs and Computer Based Training on Lead Free, BGA, CSP, Flip Chip, Chip on Board and Direct Chip Attachment. Also provides Flip Chip Evaluation kits and Anal
The DPC provides information on semiconductor test, assembly, and infrastructure related to known good die (KGD) and implementation of system-in-package (SiP) and other multi-chip packaging solutions using bare die, flip chip, and wafer-level chip-scale p